EP3SE50F780C4N vs EP3SE50F780C4G Comparaison
Comparaison détaillée côte à côte de EP3SE50F780C4N par Intel et EP3SE50F780C4G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ ActifComparaison des spécifications
| Paramètre | EP3SE50F780C4N | EP3SE50F780C4G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 430,00 | $593,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | — |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| Boîtier | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (FCBGA) |
| Type de montage | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Tension d'alimentation | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| Température de fonctionnement | 0C to +85C (C4 commercial grade) | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Statut RoHS | Lead-free / RoHS compliant | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020, FBGA package) | MSL3 (per JEDEC J-STD-020) |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.76 Mbit (5760000 bit) |
| Number of I/Os | — | 488 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count from datasheet] |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Process Technology | — | 40 nm TSMC |
| Core Supply Voltage | — | 1.1 V |
| Plage de température de fonctionnement | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |
| Design Software | — | Quartus II |