EP3SE50F780I3G vs EP3SE50F780I4G Vergleich
Detaillierter Direktvergleich von EP3SE50F780I3G von Intel und EP3SE50F780I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F780I3G | EP3SE50F780I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.082,02 | $1.320,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | 5,760,000 bit (5.49 Mbit) |
| DSP Blocks | 264 (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | — |
| Gehäuse | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FBGA (FCBGA) |
| Betriebstemperatur | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | I4 |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Maximum User I/Os | — | 488 I/O |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Betriebstemperaturbereich | — | -40C to +100C (Industrial) |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LABs count] |
| Configuration Method | — | JTAG, Passive Serial, FPP, Active Serial |