EP3SE50F780I3G vs EP3SE50F780I4N Vergleich
Detaillierter Direktvergleich von EP3SE50F780I3G von Intel und EP3SE50F780I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F780I3G | EP3SE50F780I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.082,02 | $1.295,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | 5,760 Kbits |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | TSMC 40 nm | — |
| Gehäuse | 780-pin FC-FBGA (F780) 29x29 mm | 780-BBGA, FCBGA (FineLine BGA) |
| Betriebstemperatur | -40C to +100C (Industrial, I3) | -40C to +100C (industrial) |
| Speed Grade | 3 | I4 (fast, industrial) |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 | [DATA_NEEDED: moisture sensitivity level] |
| RoHS-Status | Compliant | unknown |
| Lead-Free | Yes | unknown |
| Series | — | Stratix III E |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1900 |
| User I/Os | — | 488 |
| Process Node | — | 65 nm |
| Montagestil | — | SMD/SMT |
| Halogenfrei | — | unknown |
| Number of I/O Pins | — | 488 |
| Anzahl der Pins | — | 780 (BGA balls) |