EP3SE80F1152C2 vs EP3SE260F1152C3N Vergleich
Detaillierter Direktvergleich von EP3SE80F1152C2 von Intel und EP3SE260F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktivSpezifikationsvergleich
| Parameter | EP3SE80F1152C2 | EP3SE260F1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.325,00 | $7.500,00 |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | 16,672,768 bits |
| User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Internal Operating Frequency | up to 600 MHz | — |
| Betriebstemperatur | 0 C to 85 C (Commercial) | 0 C to +85 C (Commercial) |
| Speed Grade | C2 | — |
| Gehäuse | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-BBGA, FCBGA |
| Package Code | F1152 | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III E |
| Logic Elements / Cells | — | 255,000 |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |