EP3SE80F780C3N vs EP3SE110F780C3N Vergleich
Detaillierter Direktvergleich von EP3SE80F780C3N von Intel und EP3SE110F780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE80F780C3N | EP3SE110F780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.410,00 | $1.245,00 |
| Family | Stratix III | Stratix III E |
| Logic Elements | 80,000 | — |
| Number of LABs | 3200 | — |
| Number of I/Os | 488 | — |
| Package Type | FBGA-780 (FineLine BGA) | — |
| Process Technology | 40 nm CMOS | 65 nm |
| Versorgungsspannung | 0.9 V core | — |
| Betriebstemperatur | 0 °C to 85 °C (commercial) | — |
| Internal Frequency (max) | 717 MHz | — |
| Speed Grade | C3 | — |
| Lead-Free | Yes (Pb-free) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Memory Subsystem | TriMatrix embedded memory | — |
| DSP Blocks | Yes, dedicated DSP blocks | Yes (integrated, count varies by configuration) |
| RoHS-Status | Compliant | Compliant |
| Total Pins | 780 | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| Gehäuse | — | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |