EP3SL200H780C3N vs EP3SL200H780C4L Vergleich

Detaillierter Direktvergleich von EP3SL200H780C3N von Intel und EP3SL200H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL200H780C3N EP3SL200H780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $4.995,00 $6.459,35
Family Stratix III L (low-power) —
Process Node 40 nm —
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 bits —
Logic Array Blocks (LABs) 8,000 —
User I/Os 488 —
Gehäuse 780-Ball FCBGA (HBGA), 29 x 29 mm —
Montageart Surface Mount —
Maximum Internal Clock Frequency 800 MHz —
Transceivers 24 channels, up to 3.75 Gbps —
DSP Blocks 384 —
Speed Grade C3 (commercial, -3 speed) -4 (medium performance, commercial)
Betriebstemperatur 0C to +85C (commercial) 0C to 85C (commercial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) —
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) —
MSL-Level 3 —
Lead-Free / RoHS Yes —
Mounting Pitch 1.0 mm ball pitch —
PLLs 12 (Stratix III PLL array) —
Configuration JTAG IEEE Std 1149.1, passive/active serial —
Manufacturer — Intel (formerly Altera)
Series — Stratix III
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory — 6.5 Mbit
User I/O Count — 488
Package Type — 780-ball FCBGA (FineLine BGA, HBGA)
Package Code — BGA-780 / PBGA780 / HBGA-780
Package Mounting — Surface Mount
Internal Logic Frequency — up to 717 MHz (per ampheo datasheet brief)
Lead-Free / Pb-Free — Yes (L suffix, lead-free)
RoHS-Status — Compliant
Process Technology — TSMC 40 nm
Configuration Modes — FPP, AS, PS, JTAG

Datenblätter & Ressourcen

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