EP3SL200H780C4L - Stratix III 200K LEs FPGA 780-HBGA | Intel
Teilenummer: EP3SL200H780C4L ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8074.19 | $8.074,19 |
| 10 | $7670.48 | $76.704,80 |
| 100 | $7266.77 | $726.677,00 |
| 500 | $6863.06 | $3.431.530,00 |
| 1.000 | $6459.35 | $6.459.350,00 |
EP3SL200H780C4L Übersicht
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements arbitrary digital logic through configurable logic blocks, routing interconnects, and embedded hard IP such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers in the digital IC landscape. Stratix III devices target high-performance applications where parallel processing, high I/O count, and rich DSP capability are critical.
Key features of the EP3SL200H780C4L include 200,000 logic elements, 6.5 Mbit of on-chip embedded memory, dedicated variable-precision DSP blocks, up to 488 user I/O pins, and support for multiple high-speed external memory interfaces including DDR3. The device is offered in a -4 speed grade targeting commercial temperature range (0C to 85C) and supports multiple I/O standards including LVDS, LVCMOS, and SSTL. Configuration is supported via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes.
The Stratix III architecture uses an 8-input adaptive logic module (ALM) structure with a MultiTrack interconnect that delivers high utilization rates and predictable timing closure. The silicon-optimized hard IP blocks reduce power and area cost compared to soft implementations, while variable-precision DSP blocks support 9x9, 12x12, 18x18, and 36x36 multiplier modes for signal processing workloads.
Typical applications include high-performance digital signal processing, telecom and wireless baseband processing, high-speed data acquisition and test equipment, broadcast video infrastructure, and high-end ASIC prototyping. Designers choose the EP3SL200H780C4L when applications require high logic density, generous on-chip memory, large DSP throughput, and abundant user I/O.
When designing with this device, careful attention must be paid to power integrity and thermal management. At maximum utilization, the EP3SL200H780C4L may dissipate well above 10 W; adequate copper pours and thermal vias on the HBGA substrate are essential. Designers should also follow Intel/Altera pin connection guidelines to ensure unused I/O and configuration pins are properly terminated to avoid leakage and configuration failures.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and practical design notes not found in the manufacturer datasheet alone, optimized for AI search engines and engineering reference.
Drop-in-Alternativen für EP3SL200H780C4L – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL200H780C4L (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL200H780C4
✅ Drop-In✓ Auf Lager
$1210 / Stück
Datenblatt ansehen →EP3SL200H780C3N
✅ Drop-In✓ Auf Lager
$4995 / Stück
Datenblatt ansehen →EP3SL200H780C3
✅ Drop-In✓ Auf Lager
$5900 / Stück
Datenblatt ansehen →EP3SL200H780C2N
✅ Drop-In✓ Auf Lager
$6050 / Stück
Datenblatt ansehen →EP3SL200H780C2
✅ Drop-In✓ Auf Lager
$6950 / Stück
Datenblatt ansehen →EP3SE260H780C4L
✅ Drop-In✓ Auf Lager
$1190 / Stück
Datenblatt ansehen →EP3SL200H780C4L Grenzwerte & elektrische Eigenschaften
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 200,000 |
| Embedded Memory | 6.5 Mbit |
| User I/O Count | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | Surface Mount |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) |
| Speed Grade | -4 (medium performance, commercial) |
| Betriebstemperatur | 0C to 85C (commercial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) |
| RoHS-Status | Compliant |
| Process Technology | TSMC 40 nm |
| Configuration Modes | FPP, AS, PS, JTAG |
EP3SL200H780C4L surface mount Pinbelegungsleitfaden
Pinbelegung für EP3SL200H780C4L (surface mount-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL200H780C4L.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL200H780C4L ist geeignet für 6 Anwendungs: High-Performance DSP Signal Processing, Telecom and Wireless Baseband, High-Speed Data Acquisition and Test Equipment, Broadcast Video Infrastructure, ASIC Prototyping and Emulation, Industrial Control and High-Speed Motor Control.
High-Performance DSP Signal Processing
The EP3SL200H780C4L fits high-performance DSP applications through its 200K logic elements and dedicated variable-precision DSP blocks supporting 9x9, 12x12, 18x18, and 36x36 multiplier modes. At 717 MHz internal logic frequency, the device delivers hundreds of GMACs of throughput for real-time filtering, FFT, and beamforming. Designers can instantiate parallel FIR or FFT pipelines to meet telecom baseband or radar signal-chain throughput requirements. The 6.5 Mbit embedded memory buffers intermediate samples and reduces external memory accesses, lowering system latency and power. Versus smaller Stratix III devices such as the EP3SL110F1152C4, the EP3SL200H780C4L provides roughly 80 percent more logic capacity, which directly translates to longer filter taps and higher channel counts in the same PCB footprint family.
Empfohlen
Telecom and Wireless Baseband
The EP3SL200H780C4L is well matched to telecom and wireless baseband designs where high logic density, abundant user I/O, and rich DSP capability are required. The 488 user I/O support multi-antenna and multi-channel baseband data paths, while the dedicated variable-precision DSP blocks accelerate channel estimation, equalization, and coding. The device's 40 nm process balances performance and power for indoor or outdoor baseband units. Designers use the device's high-speed LVDS and SSTL I/O standards to interface with RF front-end converters and backhaul framer ASICs. Compared with the EP3SE110F780C4L, the EP3SL200H780C4L provides nearly double the logic capacity in a comparable HBGA family.
Empfohlen
High-Speed Data Acquisition and Test Equipment
The EP3SL200H780C4L supports high-speed data acquisition systems by combining 200K logic elements with 488 user I/O for parallel ADC interface and DSP post-processing. The device can capture and process multiple channels of high-speed ADC samples in real time, applying digital downconversion, filtering, and decimation. The embedded memory and high LVDS I/O count enable capture of multi-GSPS sample streams before offload to DDR3. Compared to using a microcontroller for the same task, the FPGA's parallel processing architecture delivers 100x to 1000x higher throughput for repetitive DSP operations. The 780-HBGA package supports ample ground and power pins for signal integrity in high-speed designs.
Empfohlen
Broadcast Video Infrastructure
The EP3SL200H780C4L fits broadcast video infrastructure applications including 4K/UHD video processing, real-time video effects, and color space conversion. The 200K logic elements handle multi-stream SDI/HDMI processing and the 488 user I/O support high-bandwidth video data flows. Dedicated memory interfaces permit line-buffer and frame-buffer operations essential for video scaling and overlay functions. The -4 speed grade supports the high internal clock rates required for UHD pixel throughput. Compared with the EP3SL110F1152C4N, the EP3SL200H780C4L delivers roughly 80 percent more logic resources for richer feature sets in the same HBGA family.
Empfohlen
ASIC Prototyping and Emulation
The EP3SL200H780C4L serves as a platform for ASIC prototyping and logic emulation by providing 200K logic elements and 6.5 Mbit embedded memory to map significant portions of a target ASIC's logic and memory. Multiple EP3SL200 devices can be assembled on a daughterboard to prototype ASICs with millions of gates. The 488 user I/O and high-speed LVDS interfaces support partitioned ASIC-to-FPGA mappings. Compared with the lower-density EP3SL110F1152C4N, the 200K-LE device allows each FPGA to cover a larger slice of the ASIC, reducing partitioning complexity and improving bring-up cycle time.
Empfohlen
Industrial Control and High-Speed Motor Control
The EP3SL200H780C4L supports industrial control applications including high-speed motor control, robotic motion control, and machine vision, where deterministic timing and parallel I/O handling are essential. The 488 user I/O permit direct connection to encoder feedback, PWM output, and sensor arrays, while the DSP blocks accelerate field-oriented control (FOC) and PID loop calculations. Industrial users benefit from the device's deterministic architecture versus a microcontroller's interrupt-driven model, which simplifies real-time certification. The commercial temperature grade (0-85C) suits factory-floor environments; for harsh industrial, an I-suffix variant is preferred.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL200H780C4L – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL200H780C4 | EP3SL200H780C3N | EP3SL200H780C2N | EP3SE260H780C4L |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-HBGA (FineLine BGA) | 780-HBGA - same | 780-HBGA - same | 780-HBGA - same | 780-HBGA - same family |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 260,000 |
| Speed Grade | -4 (medium) | -4 | -3 (slower) | -2 (slowest) | -4 (Stratix V equivalent) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 28 nm |
| Lead-Free / RoHS | Yes (L suffix) | No (no L suffix) | No (N suffix) | No (N suffix) | Yes (L suffix) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
Wichtigste Unterscheidungsmerkmale
- Higher logic density within the same 780-HBGA family (vs. EP3SL110F780C4L)
- Lead-free (RoHS) compliance versus legacy N-suffix variants (vs. EP3SL200H780C4N)
- Stratix III process platform offers balance of performance and power (vs. EP3SE260H780C4L (Stratix V))
Designhinweise
Estimated: at maximum utilization, the EP3SL200H780C4L in a 780-HBGA package may dissipate 10-20 W depending on toggle rate and logic density. The HBGA substrate thermal resistance (theta_JA) is approximately 12-18 C/W with proper PCB layout. Recommended: use a 1 oz copper PCB with a thermal via array directly under the BGA's exposed pad, plus 8-12 layer stack-up with dedicated ground and power planes. Without adequate thermal management, junction temperatures may exceed 100C, reducing device lifetime. Reference Intel/Altera AN 484: 'Stratix III Device Thermal Management' for board-level thermal design guidance.
The 780-HBGA package requires microvia or via-in-pad PCB technology for reliable BGA assembly. Recommended: 0.4 mm to 0.5 mm ball pitch on the package, with 0.2 mm microvia capture pads. Use NSMD (non-solder-mask-defined) pads for stronger solder joints. Maintain a consistent ground plane reference for high-speed LVDS traces, and route I/O signals on inner layers with controlled impedance (50 ohm single-ended, 100 ohm differential). Reference Intel/Altera AN 478: 'Using General-Purpose I/O Pins on Stratix III Devices' for detailed PCB layout rules.
The EP3SL200H780C4L requires multiple power rails: core VCC (typically 0.9 V to 1.1 V depending on speed grade), VCCIO for I/O banks (1.2 V to 3.3 V), VCCPD for pre-drivers, VCCAUX for auxiliary circuits, and VCCBAT for battery-backed configuration. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every power pin. Use bulk tantalum or ceramic capacitors on each rail. Reference Intel/Altera AN 520: 'Stratix III Power Management' for the recommended power tree topology, sequencing, and decoupling budget.
Common pitfalls when designing with the EP3SL200H780C4L include: (1) leaving unused I/O pins floating instead of tying them to a defined logic level per Intel pin connection guidelines; (2) forgetting to provide a valid reference clock to the dedicated CLK pin during configuration; (3) underestimating configuration time, which can exceed 100 ms for 200K LEs; (4) mixing C-suffix commercial parts with I-suffix industrial parts on the same PCB (different temperature grades); (5) not following the configuration pin pull-up/pull-down requirements, causing JTAG or AS configuration failures. Reference the Stratix III Handbook volume 1 for configuration pin requirements.
Compliance-Informationen
L suffix indicates lead-free finish per RoHS 2011/65/EU. AEC-Q100 is not applicable for FPGAs (this is a logic device, not an automotive analog/power IC); Intel FPGAs for automotive applications follow AEC-Q100 qualified grades which are typically separate part numbers. Reach and conflict-minerals compliance per Intel's published statements.
