EP3SL200H780C4L vs EP3SL200H780I4 Vergleich
Detaillierter Direktvergleich von EP3SL200H780C4L von Intel und EP3SL200H780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780C4L | EP3SL200H780I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.459,35 | $6.255,75 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | — |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | I4 (industrial) |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| RoHS-Status | Compliant | Compliant |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 200,000 |
| Logic Array Blocks (LABs) | — | 8000 |
| Embedded Memory Bits | — | 10,901,504 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Dimensions | — | 33 mm x 33 mm |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |