EP3SL200H780I4L vs EP3SL200H780I4LN Vergleich

Detaillierter Direktvergleich von EP3SL200H780I4L von Intel und EP3SL200H780I4LN von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL200H780I4L EP3SL200H780I4LN
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.280,00
Family Stratix III L Stratix III L (Low-Power)
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (Bits) 10,901,504 —
Maximum User I/O 488 —
Core Supply Voltage 0.86 V to 1.15 V —
Process Technology 65 nm CMOS 65 nm CMOS
Internal Performance 375 MHz —
Gehäuse 780-pin FC-HFBGA (Flip-Chip) —
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +100C (Industrial) -40C to +100C (industrial)
Transceivers Up to 24 channels —
Transceiver Data Rate Up to 6.375 Gbps —
DSP Blocks 9x9 / 18x18 / 36x36 multipliers —
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II —
JTAG Support IEEE Std 1149.1 Boundary-Scan —
RoHS-Status Compliant RoHS Compliant (lead-free)
Speed Grade I4 (Industrial) I4 (Industrial, mid-speed grade)
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) —
Series — Stratix III L
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Gehäuse / Bauform — 780-BBGA, FCBGA (Flip-Chip BGA)
MSL-Level — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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