EP3SL200H780I4N vs EP3SL200H780C3N Vergleich
Detaillierter Direktvergleich von EP3SL200H780I4N von Intel und EP3SL200H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL200H780I4N | EP3SL200H780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.750,00 | $4.995,00 |
| Series | Stratix III L | — |
| Family | Stratix III (Logic-rich variant) | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | 8,000 |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | 488 |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | — |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | C3 (commercial, -3 speed) |
| Betriebstemperaturbereich | -40C to +100C (industrial) | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA, FineLine) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | — |
| RoHS-Status | Compliant | — |
| Process Node | — | 40 nm |
| Embedded Memory Bits | — | 10,901,504 bits |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| MSL-Level | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |