EP3SL50F780C4N vs EP3SE50F780C4N Vergleich

Detaillierter Direktvergleich von EP3SL50F780C4N von Intel und EP3SE50F780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL50F780C4N EP3SE50F780C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $162,00 $1.430,00
Family Stratix III L Stratix III E
Series EP3SL50 —
Logic Elements (LEs) 47,500 —
Number of LABs / CLBs 1,900 —
Total RAM Bits 2,184,192 (273 KB) —
Number of User I/Os 488 —
Number of GPIO 488 —
Gehäuse 780-BBGA, FCBGA (FBGA-780) 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Process Technology 65 nm CMOS —
Speed Grade -4 —
Betriebstemperatur 0C to +85C (commercial) 0C to +85C (C4 commercial grade)
Core Voltage Range 0.86 V to 1.15 V —
Montageart Surface Mount Surface Mount (BGA)
Lead Free / RoHS Lead free, RoHS compliant per distributor listing —
Maximum Operating Frequency 717 MHz (per family) 717 MHz
DSP Blocks Hard DSP blocks (Stratix III family) —
Memory Interface Support DDR, DDR2, DDR3 (family feature) —
Logic Elements (LE) — 47,500
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
DSP Blocks (18x18 multipliers) — 432
PLLs — 12 (per family datasheet)
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Versorgungsspannung — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
RoHS-Status — Lead-free / RoHS compliant
MSL-Level — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

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