EP3SL70F780C4L vs EP3SL70F780C3 Vergleich
Detaillierter Direktvergleich von EP3SL70F780C4L von Intel und EP3SL70F780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780C4L | EP3SL70F780C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $944,74 | $780,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | 67,500 |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | C3 |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | Quartus II (last supported v13.1) |
| Family | — | Stratix III |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Number of Pins / Balls | — | 780 |
| Gehäuse | — | 780-BBGA, FC-FBGA |
| Core Voltage (VCCINT) | — | 1.1 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Betriebstemperaturbereich | — | 0°C to 85°C (commercial) |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |