EP3SL70F780C4L vs EP3SL70F780C3 Comparaison
Comparaison détaillée côte à côte de EP3SL70F780C4L par Intel et EP3SL70F780C3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F780C4L | EP3SL70F780C3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $944,74 | $780,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | 67,500 |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | C3 |
| Température de fonctionnement | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | Quartus II (last supported v13.1) |
| Family | — | Stratix III |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Number of Pins / Balls | — | 780 |
| Boîtier | — | 780-BBGA, FC-FBGA |
| Core Voltage (VCCINT) | — | 1.1 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Plage de température de fonctionnement | — | 0°C to 85°C (commercial) |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |