EP3SL70F780C4L vs EP3SL70F780I3N Vergleich
Detaillierter Direktvergleich von EP3SL70F780C4L von Intel und EP3SL70F780I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780C4L | EP3SL70F780I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $944,74 | $1.240,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | I3 (industrial) |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V (1.05 V to 1.15 V) |
| Operating Frequency | — | 500 MHz |
| Ball Pitch | — | 1.0 mm |
| Betriebs-Sperrschichttemperatur | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |
| RoHS-Status | — | Compliant (per distributor listings) |