EP3SL70F780I3N vs EP3SL70F780I3 Vergleich
Detaillierter Direktvergleich von EP3SL70F780I3N von Intel und EP3SL70F780I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL70F780I3N | EP3SL70F780I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.240,00 | $1.096,81 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | 1.1 V |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status] |
| Embedded Memory Bits | — | 2,699,264 bits |
| Maximum User I/O | — | 488 |
| Betriebstemperatur | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Gehäuse | — | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |