EP3SL70F780I4L vs EP3SL70F780I3N Vergleich
Detaillierter Direktvergleich von EP3SL70F780I4L von Intel und EP3SL70F780I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780I4L | EP3SL70F780I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.150,00 | $1.240,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | — |
| Betriebstemperatur | -40C to +100C (industrial) | — |
| Speed Grade | I4 | I3 (industrial) |
| Power Variant | L (low static power) | — |
| Process Node | 40 nm | — |
| Configuration Method | Serial / Parallel / JTAG via Quartus II | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | None (logic/transceiver-less L variant) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant (per distributor listings) |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V (1.05 V to 1.15 V) |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Betriebs-Sperrschichttemperatur | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |