EP4CE55F29C8L vs EP4CE55F29C6N Vergleich
Detaillierter Direktvergleich von EP4CE55F29C8L von Intel und EP4CE55F29C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C8L | EP4CE55F29C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $150,00 | $49,95 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K Blocks) | 260 blocks | — |
| Embedded 18x18 Multipliers | 156 | 374 |
| Maximum User I/O Pins | 374 | [DATA_NEEDED: max user I/O count for F29 package] |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm (low-power) | 60 nm low-power |
| Gehäuse | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Betriebstemperatur | 0C to +85C (commercial, 'L' suffix) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Lead-free, RoHS compliant |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| JTAG (IEEE 1149.1) | Supported | — |
| Configuration Memory | SRAM-based (external flash required) | — |
| Logic Array Blocks (LABs) | — | 3491 |
| Total Memory Bits | — | 239,6160 |
| Maximum Operating Frequency | — | 472.5 MHz |
| I/O Voltage Support | — | 1.2 V to 3.3 V |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Methods | — | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS |