EP4CE55F29C8L vs EP4CE55F29C6N Comparación
Comparación detallada lado a lado de EP4CE55F29C8L por Intel y EP4CE55F29C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29C8L | EP4CE55F29C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $150,00 | $49,95 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K Blocks) | 260 blocks | — |
| Embedded 18x18 Multipliers | 156 | 374 |
| Maximum User I/O Pins | 374 | [DATA_NEEDED: max user I/O count for F29 package] |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm (low-power) | 60 nm low-power |
| Encapsulado | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'L' suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Lead-free, RoHS compliant |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| JTAG (IEEE 1149.1) | Supported | — |
| Configuration Memory | SRAM-based (external flash required) | — |
| Logic Array Blocks (LABs) | — | 3491 |
| Total Memory Bits | — | 239,6160 |
| Maximum Operating Frequency | — | 472.5 MHz |
| I/O Voltage Support | — | 1.2 V to 3.3 V |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Methods | — | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS |