EP4CE55F29I7N vs EP4CE55F29C8N Vergleich
Detaillierter Direktvergleich von EP4CE55F29I7N von Intel und EP4CE55F29C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29I7N | EP4CE55F29C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $154,80 | $285,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | — |
| Gehäuse | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | I7 (industrial) | 8 (commercial) |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | 60 nm (TSMC low-power) |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Supply Type | Tray | — |
| Embedded Memory | — | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Maximum User I/O Pins | — | 374 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| PLLs | — | 4 to 8 (per device) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |