EP4CE55F29I8L vs EP4CE75F29I8L Vergleich

Detaillierter Direktvergleich von EP4CE55F29I8L von Intel und EP4CE75F29I8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CE55F29I8L EP4CE75F29I8L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $131,42 $203,73
Family Cyclone IV E —
Device Logic Elements 55,856 —
Embedded Memory Bits 2,396,160 bits —
Embedded 18x18 Multipliers 156 274
Maximum User I/Os 374 —
PLLs 4 —
Global Clock Networks 20 15
Logic Array Blocks (LABs) 3,435 —
Process Technology 60 nm low-power 60 nm low power CMOS
Core Voltage VCCINT 1.0 V / 1.2 V —
Auxiliary Voltage VCCAUX 2.5 V —
I/O Voltage VCCIO 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Gehäuse 780-FBGA (FineLine BGA), 29x29 mm 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch
Operating Temperature (Industrial) -40C to +100C junction —
Speed Grade 8 8
Configuration Modes Passive Serial, Fast Passive Parallel, Active Serial, JTAG —
Montageart Surface Mount (BGA) —
RoHS-Status Compliant Compliant
Device Family — Cyclone IV E
Logic Elements (LE) — 75,408
Configurable Logic Blocks (CLBs) — 4,713
Embedded Memory (bits) — 2,810,880
Maximum User I/O — 426
General-Purpose PLLs — 4
Core Voltage — 1.2 V
Internal Operating Frequency (max) — 362 MHz
Operating Temperature Grade — Industrial (-40C to +100C junction)
Configuration Memory — SRAM-based, requires external configuration device

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