EP4CE55F29I8LN vs EP4CE55F29C8N Vergleich
Detaillierter Direktvergleich von EP4CE55F29I8LN von Intel und EP4CE55F29C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29I8LN | EP4CE55F29C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $285,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Model | EP4CE55 | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,135 | 3,491 |
| Total Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks | — |
| 18x18 Hardware Multipliers | 374 | — |
| PLLs | 4 | 4 to 8 (per device) |
| Maximum User I/O Pins | 374 | 374 |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm TSMC low-power | 60 nm (TSMC low-power) |
| Gehäuse | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Ball Pitch | 1.0 mm | — |
| Betriebstemperatur | -40C to +85C (Industrial) | — |
| Montageart | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (per OPN suffix N) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Speed Grade | — | 8 (commercial) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| RoHS-Status | — | Compliant |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |