EP4CE55F29I8LN vs EP4CE55F29C8N Comparación
Comparación detallada lado a lado de EP4CE55F29I8LN por Intel y EP4CE55F29C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29I8LN | EP4CE55F29C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $285,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Model | EP4CE55 | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,135 | 3,491 |
| Total Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks | — |
| 18x18 Hardware Multipliers | 374 | — |
| PLLs | 4 | 4 to 8 (per device) |
| Maximum User I/O Pins | 374 | 374 |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm TSMC low-power | 60 nm (TSMC low-power) |
| Encapsulado | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (per OPN suffix N) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Speed Grade | — | 8 (commercial) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Estado RoHS | — | Compliant |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |