EP4CE6E22C9LN vs EP4CE6E22I7 Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9LN von Intel und EP4CE6E22I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9LN | EP4CE6E22I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,95 | $21,50 |
| Series | Cyclone® IV E | — |
| Device Family | EP4CE6 (Cyclone IV E) | — |
| Logic Elements (LE) | 6,272 | 6,272 |
| Configurable Logic Blocks (CLB / LAB) | 392 | — |
| Embedded Memory (Total) | 276,480 bits | — |
| Distributed RAM | 270 Kbits | — |
| Block RAM (M9K) | 30 Kbits (M9K blocks) | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | 2 |
| Global Clocks | 20 | — |
| Maximum User I/O | 91 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm (low-power) |
| Gehäuse | 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch) | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Package Style | Exposed Pad, GULL WING leads (HLFQFP) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | — |
| RoHS-Status | Compliant (LEAD FREE per FindIC) | Compliant |
| Family | — | Cyclone IV E |
| Embedded Memory | — | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 15 |
| Global Clock Networks | — | 8 |
| Maximum User I/O Pins | — | 91 |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |
| MSL-Level | — | 3 (168 hours) |