EP4CE6E22C9LN vs EP4CE6E22I7 Comparación
Comparación detallada lado a lado de EP4CE6E22C9LN por Intel y EP4CE6E22I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22C9LN | EP4CE6E22I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,95 | $21,50 |
| Series | Cyclone® IV E | — |
| Device Family | EP4CE6 (Cyclone IV E) | — |
| Logic Elements (LE) | 6,272 | 6,272 |
| Configurable Logic Blocks (CLB / LAB) | 392 | — |
| Embedded Memory (Total) | 276,480 bits | — |
| Distributed RAM | 270 Kbits | — |
| Block RAM (M9K) | 30 Kbits (M9K blocks) | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | 2 |
| Global Clocks | 20 | — |
| Maximum User I/O | 91 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm (low-power) |
| Encapsulado | 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch) | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Package Style | Exposed Pad, GULL WING leads (HLFQFP) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature grade] | — |
| Estado RoHS | Compliant (LEAD FREE per FindIC) | Compliant |
| Family | — | Cyclone IV E |
| Embedded Memory | — | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 15 |
| Global Clock Networks | — | 8 |
| Maximum User I/O Pins | — | 91 |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |
| Nivel MSL | — | 3 (168 hours) |