EP4CE75F23C7 vs EP4CE55F29C7N Vergleich
Detaillierter Direktvergleich von EP4CE75F23C7 von Intel und EP4CE55F29C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F23C7 | EP4CE55F29C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $148,00 | $138,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Logic Elements | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | — |
| Embedded Memory Bits | 2,810,880 bits | — |
| M9K Memory Blocks | 305 | — |
| Embedded 18x18 Multipliers | 244 | — |
| PLLs | 4 | — |
| Maximum User I/O | 292 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 60 nm low power (TSMC) | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Operating Temperature Grade | Commercial (0C to 85C) | — |
| Configuration Modes | AS, AP, FPP, PS | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Maximum Internal Frequency | 472.5 MHz | — |
| RoHS-Status | Compliant | Compliant (LEAD FREE) |
| Logic Elements (LE) | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| User I/O Count | — | 374 |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Package Dimensions | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Speed Grade | — | -7 (C7) |
| Core Voltage | — | 1.2 V nominal |
| Versorgungsspannung | — | 1.2 V |
| Montageart | — | Surface Mount |
| Lead Free | — | Yes |
| Configuration Mode | — | JTAG, Active Serial, Passive Parallel |