EP4CE75F23C9LN vs EP4CE75F23C6N Vergleich
Detaillierter Direktvergleich von EP4CE75F23C9LN von Intel und EP4CE75F23C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F23C9LN | EP4CE75F23C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $139,85 | $189,50 |
| Series | Cyclone IV E | Cyclone IV E |
| Family | Cyclone IV E (EP4CE75) | Cyclone IV E |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | — |
| Total RAM Bits | 2,810,880 bits (274 Kbits M9K + 200 Kbits distributed) | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | — |
| Maximum User I/O | 292 | — |
| I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Process Technology | 60 nm CMOS, low-power | 60 nm |
| Maximum Internal Frequency | 265 MHz (per FindIC) / 200 MHz (typical logic) | — |
| Gehäuse | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch | — |
| Betriebstemperatur | [DATA_NEEDED: exact Tj/grade letter for C9 speed grade] | 0C to +85C (Commercial) |
| Configuration Schemes | AS, AP, FPP, PS, JTAG | — |
| RoHS / Lead-Free | Lead-free (per FindIC part description) | — |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | C9 (commercial, 9 ns) | — |
| Device Logic Elements | — | 75,408 |
| Total Memory Bits | — | 2,810,880 |
| User I/O Count | — | 292 |
| Number of Logic Blocks | — | 47 |
| Number of LABs/CLBs | — | 4,713 |
| Core Supply Voltage | — | 1.0 V / 1.2 V |
| Package Type | — | 484-FBGA |
| Pin-Anzahl | — | 484 |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |