EP4CE75F23C9LN vs EP4CE75F23C6N Comparación
Comparación detallada lado a lado de EP4CE75F23C9LN por Intel y EP4CE75F23C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE75F23C9LN | EP4CE75F23C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $139,85 | $189,50 |
| Series | Cyclone IV E | Cyclone IV E |
| Family | Cyclone IV E (EP4CE75) | Cyclone IV E |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | — |
| Total RAM Bits | 2,810,880 bits (274 Kbits M9K + 200 Kbits distributed) | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | — |
| Maximum User I/O | 292 | — |
| I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Process Technology | 60 nm CMOS, low-power | 60 nm |
| Maximum Internal Frequency | 265 MHz (per FindIC) / 200 MHz (typical logic) | — |
| Encapsulado | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch | — |
| Temperatura de funcionamiento | [DATA_NEEDED: exact Tj/grade letter for C9 speed grade] | 0C to +85C (Commercial) |
| Configuration Schemes | AS, AP, FPP, PS, JTAG | — |
| RoHS / Lead-Free | Lead-free (per FindIC part description) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | C9 (commercial, 9 ns) | — |
| Device Logic Elements | — | 75,408 |
| Total Memory Bits | — | 2,810,880 |
| User I/O Count | — | 292 |
| Number of Logic Blocks | — | 47 |
| Number of LABs/CLBs | — | 4,713 |
| Core Supply Voltage | — | 1.0 V / 1.2 V |
| Package Type | — | 484-FBGA |
| Recuento de pines | — | 484 |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |