EP4CE75F29C8L vs EP4CE75F29C8N Vergleich
Detaillierter Direktvergleich von EP4CE75F29C8L von Intel und EP4CE75F29C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29C8L | EP4CE75F29C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $109,80 | $149,75 |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Betriebstemperatur | 0C to 85C (commercial) | 0C to +85C |
| Gehäuse | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, F29) |
| Ball Count | 780 | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Series | — | Cyclone IV E |
| Number of LABs/CLBs | — | 4713 |
| Total RAM Bits | — | 2,810,880 |
| Number of I/O | — | 426 |
| Number of Logic Elements/Cells | — | 75,408 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.15 V to 1.25 V |
| Number of Multipliers (18x18) | — | 200 |
| Number of PLLs | — | 4 |
| Configuration Method | — | JTAG / Active Serial / Passive Serial |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Process Node | — | 60 nm |