EP4CE75F29C8L vs EP4CE75F29C8N Comparaison
Comparaison détaillée côte à côte de EP4CE75F29C8L par Intel et EP4CE75F29C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4CE75F29C8L | EP4CE75F29C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $109,80 | $149,75 |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Température de fonctionnement | 0C to 85C (commercial) | 0C to +85C |
| Boîtier | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, F29) |
| Ball Count | 780 | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Series | — | Cyclone IV E |
| Number of LABs/CLBs | — | 4713 |
| Total RAM Bits | — | 2,810,880 |
| Number of I/O | — | 426 |
| Number of Logic Elements/Cells | — | 75,408 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.15 V to 1.25 V |
| Number of Multipliers (18x18) | — | 200 |
| Number of PLLs | — | 4 |
| Configuration Method | — | JTAG / Active Serial / Passive Serial |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Process Node | — | 60 nm |