EP4CE75F29I7 vs EP4CE115F23I7N Vergleich
Detaillierter Direktvergleich von EP4CE75F29I7 von Intel und EP4CE115F23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I7 | EP4CE115F23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $121,30 | $87,95 |
| Series | Cyclone IV E | Cyclone IV E |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 75,408 | — |
| Embedded Memory (bits) | 2,810,880 | — |
| Embedded Memory Blocks | 274 (M9K) | — |
| Embedded 18×18 Multipliers | 200 | — |
| PLLs | 4 | — |
| User I/O Count | 426 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch |
| Betriebstemperatur | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Process Node | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V selectable | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| External Memory Interfaces | DDR/DDR2 SDRAM, QDRII SRAM | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | 3 |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | EP4CE115 (F23 package) |
| Logic Elements (LE) | — | 114,480 |
| Embedded Memory Bits | — | 3,981,312 bits |
| Maximum User I/Os | — | 280 |
| Logic Array Blocks (LABs) | — | 7,180 |
| Number of PLLs | — | 4 |
| 18x18 Hardware Multipliers | — | 266 |
| Core Voltage | — | 1.0 V / 1.2 V |
| I/O Voltage Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 60 nm low-power CMOS (TSMC) |
| Configuration Method | — | JTAG, Active Serial, Active Parallel |
| Lead-Free | — | Yes |