EP4CE75F29I7 vs EP4CE75F29C7 Vergleich
Detaillierter Direktvergleich von EP4CE75F29I7 von Intel und EP4CE75F29C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I7 | EP4CE75F29C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $121,30 | $199,96 |
| Series | Cyclone IV E | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 75,408 | 75 408 |
| Embedded Memory (bits) | 2,810,880 | — |
| Embedded Memory Blocks | 274 (M9K) | — |
| Embedded 18×18 Multipliers | 200 | — |
| PLLs | 4 | 4 |
| User I/O Count | 426 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F29, 29 mm) |
| Betriebstemperatur | -40 °C to +100 °C (Industrial) | — |
| Process Node | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V selectable | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| External Memory Interfaces | DDR/DDR2 SDRAM, QDRII SRAM | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | 3 (per JEDEC J-STD-020) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone IV E |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Embedded Memory Bits | — | 2 810 880 (4.5 Mbit, M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 274 |
| Maximum User I/O | — | 426 |
| Process Technology | — | 60 nm |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | JTAG, Active Serial (AS), Passive Serial (PS) |
| Block Memory Type | — | M9K (9 Kbit blocks) |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |