EP4CE75F29I7 vs EP4CE75F29I7N Vergleich
Detaillierter Direktvergleich von EP4CE75F29I7 von Intel und EP4CE75F29I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I7 | EP4CE75F29I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $121,30 | $540,00 |
| Series | Cyclone IV E | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 75,408 | — |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 |
| Embedded Memory Blocks | 274 (M9K) | — |
| Embedded 18×18 Multipliers | 200 | — |
| PLLs | 4 | 4 |
| User I/O Count | 426 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F29) |
| Betriebstemperatur | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Process Node | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V selectable | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| External Memory Interfaces | DDR/DDR2 SDRAM, QDRII SRAM | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 75,408 |
| Logic Array Blocks (LAB) | — | 4,633 |
| Embedded 18x18 Multipliers | — | 426 |
| Global Clocks | — | 20 |
| Maximum User I/O Pins | — | 426 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-k |