EP4CE75F29I8L vs EP4CE55F29I8L Vergleich
Detaillierter Direktvergleich von EP4CE75F29I8L von Intel und EP4CE55F29I8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I8L | EP4CE55F29I8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $203,73 | $131,42 |
| Device Family | Cyclone IV E | — |
| Logic Elements (LE) | 75,408 | — |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory (bits) | 2,810,880 | — |
| Embedded 18x18 Multipliers | 274 | 156 |
| Maximum User I/O | 426 | — |
| General-Purpose PLLs | 4 | — |
| Global Clock Networks | 15 | 20 |
| Core Voltage | 1.2 V | — |
| Internal Operating Frequency (max) | 362 MHz | — |
| Process Technology | 60 nm low power CMOS | 60 nm low-power |
| Gehäuse | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch | 780-FBGA (FineLine BGA), 29x29 mm |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | 8 | 8 |
| Configuration Memory | SRAM-based, requires external configuration device | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone IV E |
| Device Logic Elements | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 bits |
| Maximum User I/Os | — | 374 |
| PLLs | — | 4 |
| Logic Array Blocks (LABs) | — | 3,435 |
| Core Voltage VCCINT | — | 1.0 V / 1.2 V |
| Auxiliary Voltage VCCAUX | — | 2.5 V |
| I/O Voltage VCCIO | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature (Industrial) | — | -40C to +100C junction |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Montageart | — | Surface Mount (BGA) |