EP4CGX110DF23I7N vs EP4CGX110CF23C8N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CGX110CF23C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CGX110CF23C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $170,45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | 4 channels |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Betriebstemperatur | -40C to +100C (industrial) | 0 C to 85 C (commercial) |
| Speed Grade | 7 | C8 |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-ball FBGA (F23) |
| Package Code | BGA (FBGA) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Core Voltage | — | 1.2 V |
| Lead-Free | — | Yes |
| MSL-Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |