EP4CGX110DF23I7N vs EP4CGX110CF23C8N Comparison
Detailed side-by-side comparison of EP4CGX110DF23I7N by Intel and EP4CGX110CF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110DF23I7N | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | 4 channels |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Operating Temperature | -40C to +100C (industrial) | 0 C to 85 C (commercial) |
| Speed Grade | 7 | C8 |
| Package | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-ball FBGA (F23) |
| Package Code | BGA (FBGA) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Core Voltage | — | 1.2 V |
| Lead-Free | — | Yes |
| MSL Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |