EP4CGX110DF23I7N vs EP4CGX110CF23I7 Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CGX110CF23I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CGX110CF23I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $338,55 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | 66 |
| Transceivers | Up to 3.125 Gbps embedded transceivers | 8 channels up to 3.125 Gbps |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Betriebstemperatur | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | 7 | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-pin FBGA (F23) |
| Package Code | BGA (FBGA) | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Logic Elements (LE) | — | 109,424 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory Bits | — | 5,621,760 bits |
| M9K Memory Blocks | — | [DATA_NEEDED: M9K block count] |
| User I/O | — | 270 |
| PLLs | — | 8 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Lead-Free | — | Yes |