EP4CGX110DF23I7N vs EP4CGX110CF23I7 Comparación
Comparación detallada lado a lado de EP4CGX110DF23I7N por Intel y EP4CGX110CF23I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF23I7N | EP4CGX110CF23I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $182,00 | $338,55 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | 66 |
| Transceivers | Up to 3.125 Gbps embedded transceivers | 8 channels up to 3.125 Gbps |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | 7 | — |
| Encapsulado | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-pin FBGA (F23) |
| Package Code | BGA (FBGA) | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Logic Elements (LE) | — | 109,424 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory Bits | — | 5,621,760 bits |
| M9K Memory Blocks | — | [DATA_NEEDED: M9K block count] |
| User I/O | — | 270 |
| PLLs | — | 8 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Lead-Free | — | Yes |