EP4CGX110DF23I7N vs EP4CGX50DF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CGX50DF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CGX50DF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $105,20 |
| Family | Cyclone IV GX | Cyclone IV |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 2,562 Kbit |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Betriebstemperatur | -40C to +100C (industrial) | — |
| Speed Grade | 7 | I7 |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-ball FBGA (BGA-484) |
| Package Code | BGA (FBGA) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Series | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Number of Logic Cells | — | 49,888 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum User I/O Pins | — | 290 |
| Number of Transceivers | — | 8 (3.125 Gbps) |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.00 mm |
| Operating Temperature (Industrial) | — | -40 C to +100 C |
| Number of PLLs | — | 4 |