EP4CGX110DF31C8N vs EP4CGX110DF31C7N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF31C8N von Intel und EP4CGX110DF31C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF31C8N | EP4CGX110DF31C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $325,00 | $112,40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) | — |
| Embedded Memory Blocks | M9K blocks, 9-bit parity | — |
| DSP Blocks (18x18 Multipliers) | 264 multipliers | — |
| Maximum User I/Os | 475 | — |
| I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | 4 general-purpose |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps | 8 channels, up to 3.125 Gbps |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Gehäuse | 896-ball FineLine BGA (F31), 31 mm | 896-ball FBGA (F31) |
| Operating Temperature (Commercial) | 0C to 85C | 0 °C to 85 °C (TJ) |
| Speed Grade | 8 | C7 (commercial) |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| Maximum User I/O | — | 475 |
| Core Voltage (VCCINT) | — | 1.2 V nominal (1.16 V to 1.24 V) |
| PLL Analog Voltage (VCCA) | — | 2.5 V nominal (2.375 V to 2.625 V) |
| I/O Bank Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Hard IP Block | — | PCIe Gen1 x1/x2/x4 |
| Montageart | — | Surface Mount |