EP4CGX110DF31C8N vs EP4CGX110DF31C7N Comparação
Comparação detalhada lado a lado de EP4CGX110DF31C8N por Intel e EP4CGX110DF31C7N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4CGX110DF31C8N | EP4CGX110DF31C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $325,00 | $112,40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) | — |
| Embedded Memory Blocks | M9K blocks, 9-bit parity | — |
| DSP Blocks (18x18 Multipliers) | 264 multipliers | — |
| Maximum User I/Os | 475 | — |
| I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | 4 general-purpose |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps | 8 channels, up to 3.125 Gbps |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Encapsulamento | 896-ball FineLine BGA (F31), 31 mm | 896-ball FBGA (F31) |
| Operating Temperature (Commercial) | 0C to 85C | 0 °C to 85 °C (TJ) |
| Speed Grade | 8 | C7 (commercial) |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| Maximum User I/O | — | 475 |
| Core Voltage (VCCINT) | — | 1.2 V nominal (1.16 V to 1.24 V) |
| PLL Analog Voltage (VCCA) | — | 2.5 V nominal (2.375 V to 2.625 V) |
| I/O Bank Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Hard IP Block | — | PCIe Gen1 x1/x2/x4 |
| Tipo de montagem | — | Surface Mount |