EP4CGX30BF14C7 vs EP4CGX30BF14C7N Vergleich
Detaillierter Direktvergleich von EP4CGX30BF14C7 von Intel und EP4CGX30BF14C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX30BF14C7 | EP4CGX30BF14C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,10 | $55,78 |
| Series | Cyclone® IV GX | — |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 29,440 | — |
| Total Memory Bits | 1,105,920 bits | 1,105,920 bits |
| Embedded Multipliers (18x18) | 66 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Transceivers | Up to 4 channels, 3.125 Gbps | Up to 3.125 Gbps (channel count [DATA_NEEDED: per-package transceiver count]) |
| User I/O Pins | 72 | — |
| Gehäuse | 169-ball FBGA (F14) | 169-LBGA (FineLine BGA, 14x14 mm) |
| Package Code | LBGA-169 | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0°C to +85°C (commercial C) |
| Speed Grade | C7 | 7 (commercial) |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant (per distributor listings) | Compliant |
| Logic Elements (LE) | — | 29,440 |
| Logic Array Blocks (LABs) | — | 1840 |
| Embedded Memory | — | M9K blocks |
| Maximum User I/O | — | 72 |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Modes | — | Passive Serial, Fast Passive Serial, JTAG, AS, AP |
| DSP Blocks | — | Embedded 18x18 multipliers |
| Versorgungsspannung | — | 1.2 V core, 2.5 V / 3.3 V I/O (per bank) |