EP4CGX30BF14C7 vs EP4CGX30BF14C7N Comparación
Comparación detallada lado a lado de EP4CGX30BF14C7 por Intel y EP4CGX30BF14C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX30BF14C7 | EP4CGX30BF14C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,10 | $55,78 |
| Series | Cyclone® IV GX | — |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 29,440 | — |
| Total Memory Bits | 1,105,920 bits | 1,105,920 bits |
| Embedded Multipliers (18x18) | 66 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Transceivers | Up to 4 channels, 3.125 Gbps | Up to 3.125 Gbps (channel count [DATA_NEEDED: per-package transceiver count]) |
| User I/O Pins | 72 | — |
| Encapsulado | 169-ball FBGA (F14) | 169-LBGA (FineLine BGA, 14x14 mm) |
| Package Code | LBGA-169 | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0°C to +85°C (commercial C) |
| Speed Grade | C7 | 7 (commercial) |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant (per distributor listings) | Compliant |
| Logic Elements (LE) | — | 29,440 |
| Logic Array Blocks (LABs) | — | 1840 |
| Embedded Memory | — | M9K blocks |
| Maximum User I/O | — | 72 |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Modes | — | Passive Serial, Fast Passive Serial, JTAG, AS, AP |
| DSP Blocks | — | Embedded 18x18 multipliers |
| Tensión de alimentación | — | 1.2 V core, 2.5 V / 3.3 V I/O (per bank) |