EP4CGX30CF19C6 vs EP4CGX30CF19I6N Vergleich
Detaillierter Direktvergleich von EP4CGX30CF19C6 von Intel und EP4CGX30CF19I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX30CF19C6 | EP4CGX30CF19I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $20,75 | $52,10 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 29,440 LE | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 1,840 | — |
| Total RAM Bits | 1,105,920 bits | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/Os | 150 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count for F19 package] | — |
| Transceiver Data Rate | [DATA_NEEDED: max transceiver data rate] | — |
| Embedded Multipliers (18x18) | 66 | — |
| PLLs | 4 | 4 |
| Operating Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | 60 nm |
| Gehäuse / Bauform | 324-LBGA (F19, 19 mm) | — |
| Montagestil | SMD/SMT | — |
| Betriebstemperatur | 0 C to +70 C (Commercial) | -40C to +100C (industrial) |
| Speed Grade | C6 | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements (LE) | — | 29,440 |
| Embedded Memory | — | 108 Kb (M9K blocks) |
| Number of Memory Blocks | — | 4 |
| Embedded 18x18 Multipliers | — | 66 |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Maximum User I/O | — | 364 |
| Core Supply Voltage | — | 1.2 V nominal (1.16 V to 1.24 V) |
| Gehäuse | — | FBGA-324 (Plastic, 19 mm x 19 mm) |
| Temperature Grade Suffix | — | I6N (industrial, lead-free) |
| Package Code | — | F19 |
| Lead-Free | — | Yes |
| Design Tool | — | Quartus Prime |