EP4CGX30CF19C6 vs EP4CGX30CF19I6N Comparación
Comparación detallada lado a lado de EP4CGX30CF19C6 por Intel y EP4CGX30CF19I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX30CF19C6 | EP4CGX30CF19I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $20,75 | $52,10 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 29,440 LE | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 1,840 | — |
| Total RAM Bits | 1,105,920 bits | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/Os | 150 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count for F19 package] | — |
| Transceiver Data Rate | [DATA_NEEDED: max transceiver data rate] | — |
| Embedded Multipliers (18x18) | 66 | — |
| PLLs | 4 | 4 |
| Operating Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | 60 nm |
| Encapsulado / Carcasa | 324-LBGA (F19, 19 mm) | — |
| Estilo de montaje | SMD/SMT | — |
| Temperatura de funcionamiento | 0 C to +70 C (Commercial) | -40C to +100C (industrial) |
| Speed Grade | C6 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements (LE) | — | 29,440 |
| Embedded Memory | — | 108 Kb (M9K blocks) |
| Number of Memory Blocks | — | 4 |
| Embedded 18x18 Multipliers | — | 66 |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Maximum User I/O | — | 364 |
| Core Supply Voltage | — | 1.2 V nominal (1.16 V to 1.24 V) |
| Encapsulado | — | FBGA-324 (Plastic, 19 mm x 19 mm) |
| Temperature Grade Suffix | — | I6N (industrial, lead-free) |
| Package Code | — | F19 |
| Lead-Free | — | Yes |
| Design Tool | — | Quartus Prime |