EP4CGX30CF23I7N vs EP4CGX75CF23I7N Vergleich

Detaillierter Direktvergleich von EP4CGX30CF23I7N von Intel und EP4CGX75CF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CGX30CF23I7N EP4CGX75CF23I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $41,20 $165,30
Series Cyclone IV GX EP4CGX75 (F23)
Device Family Cyclone IV GX —
Logic Elements (LE) 29,440 73,920
Embedded Memory Bits 1,105,920 bits (108 Kb RAM blocks) —
Embedded 18x18 Multipliers 66 —
Total Transceivers 8 (3.125 Gbps) —
PLLs [DATA_NEEDED: PLL count] 8
User I/O Pins (max) 290 —
Gehäuse 484-ball FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch
Betriebstemperatur -40C to +85C (industrial) -40C to +100C (industrial I7 grade)
Speed Grade 7 (fast) —
Core Voltage 1.2 V —
I/O Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) —
Process Technology 60 nm low-power —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG, Active Serial Active Serial, Passive Serial, JTAG, Fast Passive Parallel
Hard IP Blocks PCIe Gen1 x1/x2, GIGE PHY —
RoHS-Status Compliant Lead-free (compliant per datasheet.com excerpt)
Lead-Free Yes —
Family — Cyclone IV GX
Configurable Logic Blocks (CLBs) — 4,620
Embedded Memory — 4,257,792 bits (316 M9K blocks)
Embedded Multipliers (18x18) — 150
User I/O Pins — 290
Transceivers — 8 channels up to 3.125 Gbps
Montageart — Surface Mount (FBGA)
Process Node — 60 nm low-power
MSL-Level — 3 (per typical Altera FBGA)

Datenblätter & Ressourcen

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