EP4CGX50CF23C6N vs EP4CGX50DF23C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C6N von Intel und EP4CGX50DF23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C6N | EP4CGX50DF23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $65,80 | $43,20 |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX50 | — |
| Logic Elements (LE) | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks (M9K) | 56 | — |
| Embedded 18x18 Multipliers | 132 | 66 |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 11 | 8 (with up to 16 clock pins per region) |
| Maximum User I/O | 290 | — |
| Transceivers | Up to 8 channels at 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Gehäuse | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 | — |
| RoHS-Status | Compliant | Compliant (Pb-free variant) |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 49,888 |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| PLLs | — | 2 |
| Number of I/O Pins | — | 290 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Montageart | — | Surface Mount |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| MSL-Level | — | 3 (168 hours) |