EP4CGX50CF23I7NAA vs EP4CGX50CF23C6N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23I7NAA von Intel und EP4CGX50CF23C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23I7NAA | EP4CGX50CF23C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $79,50 | $65,80 |
| Family | Cyclone IV GX | — |
| Logic Elements (LEs) | 49,888 | — |
| Logic Array Blocks (LABs) | 3,136 | — |
| Embedded Memory (Bits) | 2,562,048 | — |
| Embedded Memory (M9K Blocks) | 270 | — |
| Embedded 18x18 Multipliers | 132 | 132 |
| Phase-Locked Loops (PLLs) | 4 | 4 |
| Global Clock Networks | 20 | 11 |
| Maximum User I/O Pins | [DATA_NEEDED: exact max user I/O for F484] | — |
| Transceivers | 8 channels, up to 3.125 Gbps | Up to 8 channels at 3.125 Gbps |
| Core Voltage | 1.2 V | — |
| Betriebstemperaturbereich | -40C to +100C (Industrial, I7) | — |
| Speed Grade | 7 | C6 |
| Gehäuse | 484-ball FineLine BGA (F23), 1.0mm pitch | 484-ball FineLine BGA (FBGA-484) |
| Montageart | Surface Mount (BGA) | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Series | — | Cyclone IV GX |
| Device Family | — | EP4CGX50 |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Total Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks (M9K) | — | 56 |
| Maximum User I/O | — | 290 |
| Core Supply Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS |
| Package Dimensions | — | 23 x 23 mm, 1.0 mm pitch |
| Betriebstemperatur | — | 0C to +85C (Commercial) |