EP4CGX50CF23I7NAA vs EP4CGX50CF23C6N Comparación
Comparación detallada lado a lado de EP4CGX50CF23I7NAA por Intel y EP4CGX50CF23C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50CF23I7NAA | EP4CGX50CF23C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $79,50 | $65,80 |
| Family | Cyclone IV GX | — |
| Logic Elements (LEs) | 49,888 | — |
| Logic Array Blocks (LABs) | 3,136 | — |
| Embedded Memory (Bits) | 2,562,048 | — |
| Embedded Memory (M9K Blocks) | 270 | — |
| Embedded 18x18 Multipliers | 132 | 132 |
| Phase-Locked Loops (PLLs) | 4 | 4 |
| Global Clock Networks | 20 | 11 |
| Maximum User I/O Pins | [DATA_NEEDED: exact max user I/O for F484] | — |
| Transceivers | 8 channels, up to 3.125 Gbps | Up to 8 channels at 3.125 Gbps |
| Core Voltage | 1.2 V | — |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial, I7) | — |
| Speed Grade | 7 | C6 |
| Encapsulado | 484-ball FineLine BGA (F23), 1.0mm pitch | 484-ball FineLine BGA (FBGA-484) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Series | — | Cyclone IV GX |
| Device Family | — | EP4CGX50 |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Total Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks (M9K) | — | 56 |
| Maximum User I/O | — | 290 |
| Core Supply Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS |
| Package Dimensions | — | 23 x 23 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |