EP4CGX50CF23I7NAA vs EP4CGX50CF23I7 Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23I7NAA von Intel und EP4CGX50CF23I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23I7NAA | EP4CGX50CF23I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $79,50 | $112,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Logic Array Blocks (LABs) | 3,136 | 3,118 |
| Embedded Memory (Bits) | 2,562,048 | — |
| Embedded Memory (M9K Blocks) | 270 | — |
| Embedded 18x18 Multipliers | 132 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact max user I/O for F484] | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Betriebstemperaturbereich | -40C to +100C (Industrial, I7) | — |
| Speed Grade | 7 | — |
| Gehäuse | 484-ball FineLine BGA (F23), 1.0mm pitch | 484-FBGA, F23, 23x23 mm, 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | — |
| Configuration Scheme | AS, PS, JTAG, FPP | Active Serial, Passive Serial, JTAG |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Device Logic Elements | — | 49,888 |
| Embedded Memory (bits) | — | 2,562,048 |
| Embedded Memory (M9K blocks) | — | 290 |
| 18x18 Multipliers | — | 220 |
| PLLs | — | 6 |
| Maximum User I/Os | — | 290 |
| Transceivers (GXB) | — | Up to 8 (3.125 Gbps) |
| Process Technology | — | 60 nm low-power |
| Betriebstemperatur | — | -40C to +100C (Industrial) |