EP4CGX50CF23I7NAA vs EP4CGX50CF23I7 Comparación
Comparación detallada lado a lado de EP4CGX50CF23I7NAA por Intel y EP4CGX50CF23I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50CF23I7NAA | EP4CGX50CF23I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $79,50 | $112,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Logic Array Blocks (LABs) | 3,136 | 3,118 |
| Embedded Memory (Bits) | 2,562,048 | — |
| Embedded Memory (M9K Blocks) | 270 | — |
| Embedded 18x18 Multipliers | 132 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact max user I/O for F484] | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial, I7) | — |
| Speed Grade | 7 | — |
| Encapsulado | 484-ball FineLine BGA (F23), 1.0mm pitch | 484-FBGA, F23, 23x23 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | — |
| Configuration Scheme | AS, PS, JTAG, FPP | Active Serial, Passive Serial, JTAG |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Device Logic Elements | — | 49,888 |
| Embedded Memory (bits) | — | 2,562,048 |
| Embedded Memory (M9K blocks) | — | 290 |
| 18x18 Multipliers | — | 220 |
| PLLs | — | 6 |
| Maximum User I/Os | — | 290 |
| Transceivers (GXB) | — | Up to 8 (3.125 Gbps) |
| Process Technology | — | 60 nm low-power |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |